AGP Picks
View all

JST unveils upgraded Apex wafer dryer for tighter defect control

7 hours ago
By AI, Created 15:00 UTC, Oct 13, 2026, AGP -

JST has launched Apex, an upgraded IPA-based Marangoni wafer dryer designed to cut drying time and reduce particle defects for semiconductor manufacturing. The system is available now and can be retrofitted to existing JST dryers as device nodes continue to shrink.

Why it matters: - Semiconductor device yields are increasingly sensitive to particle contamination as node sizes shrink. - JST says Apex is designed to lower defect size and density while improving drying speed. - The dryer targets advanced packaging applications used in AI, high-bandwidth memory and other critical semiconductor uses.

What happened: - JST announced Apex, its upgraded Marangoni-type isopropyl alcohol-based wafer dryer, on October 13, 2026. - The company launched the dryer from Meridian, Idaho. - Apex delivers 10% to 15% shorter drying cycle times than JST’s existing IPA dryer. - The system is available now for purchase.

The details: - Apex uses proprietary contact material in the wafer carrier to eliminate carrier marks. - The carrier material speeds liquid absorption, leaves no residue and maximizes defect-free surface area with minimal edge exclusion. - A new drying methodology keeps IPA concentration stable during the process. - The dryer also adds tighter temperature and distance control in the drying tank. - JST says those controls help meet stricter contaminant particle-size requirements driven by finer device nodes. - The Apex system can produce particles as small as 28nm. - Apex can be retrofitted to existing JST Marangoni-type dryer models. - JST has also added Apex to its Applications Lab, the company’s live-testing environment that was upgraded earlier this year. - The lab updates are intended to support customer demand for finer applications and tighter specifications.

Between the lines: - The product launch appears aimed at one of the most persistent yield problems in advanced semiconductor manufacturing: contamination during wet processing. - JST’s emphasis on retrofitting suggests the company is targeting both new tool sales and upgrades to installed equipment. - Dr. Ismail Kashkoush, JST’s CTO, said the company worked with a key customer for more than six months to develop the capabilities. - Kashkoush said the goal was to reduce defects per wafer and support high-aspect-ratio features in advanced packaging.

What's next: - JST is presenting Apex at SEMICON West, Oct. 13-15, 2026, at the Moscone Center in San Francisco. - The company will be at Booth 1747. - More information is available at the company's website or by email at sales@jstmfg.com.

The bottom line: - JST is pitching Apex as a faster wafer dryer built for the tighter contamination standards of next-generation semiconductor manufacturing.

Disclaimer: This article was produced by AGP Wire with the assistance of artificial intelligence based on original source content and has been refined to improve clarity, structure, and readability. This content is provided on an “as is” basis. While care has been taken in its preparation, it may contain inaccuracies or omissions, and readers should consult the original source and independently verify key information where appropriate. This content is for informational purposes only and does not constitute legal, financial, investment, or other professional advice.

Sign up for:

New Products Launch Guide

The daily local news briefing you can trust. Every day. Subscribe now.

By signing up, you agree to our Terms & Conditions.

Share this page:

Advanced Search Options

Search for:

Search scope:

Type:

Search in:

Date range:

The last

Sort by:

Sign up for:

New Products Launch Guide

The daily local news briefing you can trust. Every day. Subscribe now.

By signing up, you agree to our Terms & Conditions.